Phone.: +36-1/299-70-70 | E-mail: sales@epselectronics.com
Dow Silicones is launching EI-2888
2019.02.18.

DOWSILTM EI-2888 is the newest primerless silicone encapsulant from Dow Silicones. Featuring good primerless adhesion, inhibition resistance and superb optical clarity, this innovative product is particularly suitable for encapsulating rigid and flexible circuit boards for LED Lighting, explosion proof and high ingress protection rated luminaire.

PACE Arm-Evac 150
2019.01.21.

PACE launches Arm-Evac 150, a new low-cost fume extraction system for benchtop soldering and rework applications. The central filtration unit is a quiet, low profile, compact system which fits under any workbench. Comes complete with a general purpose combo filter, SteadyFlexTM ESD-safe arm & nozzle assembly and wireless remote control.

Lord

 

LORD is a diversified technology company with a long history of developing breakthrough adhesive, coating and motion management technologies that significantly improve the performance of our customers' products. We have provided innovative solutions to demanding aerospace, defense, automotive and industrial customer problems for nearly 90 years. With technology centers and manufacturing locations around the world, our 2,900+ employees are ready to serve you.

LORD is a worldwide leader in adhesives and coatings, vibration and motion control, and magnetically responsive technologies.

LORD  product portfolio and technical expertise includes multiple chemistries, namely urethanes, epoxies and silicones. This product and expertise diversity allow to select the chemistry that is the best fit for customers' performance and cost requirements.

For electronic industry, LORD  continue developing world-class thick film, thermal management, semiconductor packing, LED and potting and encapsulation materials for demanding applications. The experience in electronic materials spans more than 40 years, and incorporate this vast knowledge in developing solutions for new applications to help ensure our customers' success.

Lord Expertise and Capabilities

– Experience in supplying products for automotive electronics applications for over 50 years.

– Electronic materials available in three chemistries; epoxy, urethane and silicone.

– Materials application and electronics reliability test equipment to support product development

– Flexible manufacturing from bulk containers to syringes.

– Global manufacturing and technical support

Potting and encapsulating materials for: Potants and encapsulants

– Electronic ignition and engine control modules

– Ride level and wheel speed sensors

– Tire pressure sensors

– Lighting ballasts and HID lighting

– Capacitors, switches, connectors and relays

– DC/DC converters

– Circuit boards

– Engine/transmission controller

 

Adhesives

– Lid sealing

Thermal management

– Circuit board component assemblies

LED lighting

– Solar industries

– Battery Assembly

– Radio boards

 

Encapsulants, Adhesives and Coatings

Product Properties

– High temperature epoxy and silicones for harsh environment exposures.

– Low modulus urethane encapsulants for protection of delicate electronics.

– Low shrink, low stress epoxy encapsulants and adhesives for delicate electronics and harsh environments.

– Fast cure one-component epoxy and silicone encapsulants, adhesives and coatings.

– Unique hybrid epoxy-silicone and urethane-polyester chemistries.

 

Application Chemistry

Parameter

 Urethane

Epoxy

Silicone

Cost

 Moderate

Moderate

High

Processing

Most Difficult

Best

Moderate

Operating Range

-50°C to + 105°C

 -40°C to + 130°C

-120°C to + 200°C

Repairability

Good

Poor

Excellent

Adhesive Strength

Moderate

High

Low

Modulus

Moderate

 High

 Low

Chemical Resistance

Moderate

High

 Low

Electrical Insulation

Good

 Excellent

 Excellent

Dielectric Constant

 Moderate

Moderate

Low

 

Soldering Solder Tin Lead LeadFree
Glueing Coating Selective Conformal Paste
Thermally conductive Silicone Poliuretane Acryl Epoxy
Fluxing Flux Alcohol based Water based Bar
Wire UV BGA Rework X-ray

 

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