Phone.: +36-1/299-70-70 | E-mail: sales@epselectronics.com
Dow Silicones is launching EI-2888
2019.02.18.

DOWSILTM EI-2888 is the newest primerless silicone encapsulant from Dow Silicones. Featuring good primerless adhesion, inhibition resistance and superb optical clarity, this innovative product is particularly suitable for encapsulating rigid and flexible circuit boards for LED Lighting, explosion proof and high ingress protection rated luminaire.

PACE Arm-Evac 150
2019.01.21.

PACE launches Arm-Evac 150, a new low-cost fume extraction system for benchtop soldering and rework applications. The central filtration unit is a quiet, low profile, compact system which fits under any workbench. Comes complete with a general purpose combo filter, SteadyFlexTM ESD-safe arm & nozzle assembly and wireless remote control.

Tannlin

 

Tannlin operate a Stencil production site in Budapest in Hungary co-resident with our European agent EPS. We have additional operations in Timisoara in Romania and Prestwick and Hook in the UK. Each facility is a copy exact production operation with dedicated local CAD and technology support staff. The sites are fully equipped with the latest Tannlin T11 stencil laser cutting systems and ancillary equipment. They operate under the strict Tannlin operating processes and quality management system ensuring we meet our requirements for accuracy and repeatability. Customer communication and operational control is all managed through our proprietary on-line Blueprint application.

Laser cut stencils

A unique understanding of stencil production and surface mount assembly processes gives Tannlin an in-depth appreciation of the need for accuracy to support process control, consistency and stability. Tannlin-manufactured stencils will contribute positively to yield and quality through unparalleled cut-edge quality and geometry, ensuring optimal paste release.

Tannlin laser cut stencils provide:

  • Aperture sizes accurate to 1 micron, for apertures as small as 20 microns
  • Material thickness from 20 microns up to 500 microns
  • Superior surface flatness compared with full electroformed stencils
  • Optimised surface finish for enhanced paste roll
  • Extended stencil life on nickel plated stencils for high volume production
  • Consistent paste release for area ratios as low as 0.5 with no additional surface treatments.
  • Nanocoat stencil treatment

 

Link to Tannlin web site

Soldering Solder Tin Lead LeadFree
Glueing Coating Selective Conformal Paste
Thermally conductive Silicone Poliuretane Acryl Epoxy
Fluxing Flux Alcohol based Water based Bar
Wire UV BGA Rework X-ray

 

Honlapkészítés: Ujlap.hu