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Dow Silicones is launching EI-2888

DOWSILTM EI-2888 is the newest primerless silicone encapsulant from Dow Silicones. Featuring good primerless adhesion, inhibition resistance and superb optical clarity, this innovative product is particularly suitable for encapsulating rigid and flexible circuit boards for LED Lighting, explosion proof and high ingress protection rated luminaire.

PACE Arm-Evac 150

PACE launches Arm-Evac 150, a new low-cost fume extraction system for benchtop soldering and rework applications. The central filtration unit is a quiet, low profile, compact system which fits under any workbench. Comes complete with a general purpose combo filter, SteadyFlexTM ESD-safe arm & nozzle assembly and wireless remote control.


952-S Low-Solids No-Clean Tacky Liquid Flux

Kester Flux 952S is a no-clean, non-corrosive, halogen free liquid non rosin organic flux designed for wave soldering of conventional and surface mount circuit board assemblies. The extremely low solid content (2%) and nature of activator system results in practically no residues left on the assembly after soldering. Boards are dry and cosmetically clean as they exit the wave solder machine. There are no residues to interfere with electrical testing and the expense of cleaning is eliminated.


Kester Flux 952S is exhibiting improved soldering performance to minimize soldering bridges (shorts) and excessive solder defects. This non-corrosive and non conductive flux meets the strictest equirements of Bellcore TR-TSY-000078 specification. This flux is suitable for automotive, computer, telecommunications and other applications where reliability considerations are critical. The surface insulation resistance on soldered boards is higher than that provided by typical organic water-soluble fluxes.


Performance Characteristics

· Minimize micro-solderballs

· Halogen free

· Improves soldering performance

· Eliminates the need and expense of cleaning

· Conforms to ANSI/J-STD-004, Flux Classification ORL0

· Conforms to ISO 9454-1:213A.

· Conforms to Bellcore TR-TSY-000078 specification

959T Low-Solids No-Clean Flux Pen®

For Lead-bearing and Lead-free alloys


Kester 959T is a no-clean, non-corrosive, halide free Flux Pen® that is specifically designed for lead-free rework of conventional and surface mount circuit board assemblies. Essentially no residue remains after soldering. Kester 959T was developed with a modified surface tension to aid in soldering boards that have surface mount and high component densities. This comprehensive formulation possesses improved wetting characteristics and also exhibits superior corrosion inhibiting properties and provides a non-tacky residue. A major advantage of this flux is the reduced odor associated with the soldering process. Kester 959T incorporates a small amount of rosin for higher reliablility.


Performance Characteristics:

• Residues almost colorless

• Improves soldering performance

• Reduced odor associated with soldering process

• Eliminates the need and expense of cleaning

• Non-corrosive tack-free residues

• Contains < 0.5% Rosin

• Classified as ORL0 per J-STD-004

• Compliant to Bellcore GR-78


You can find any others Solar materials in the Kester website:

Soldering Solder Tin Lead LeadFree
Glueing Coating Selective Conformal Paste
Thermally conductive Silicone Poliuretane Acryl Epoxy
Fluxing Flux Alcohol based Water based Bar
Wire UV BGA Rework X-ray