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Dow Silicones is launching EI-2888

DOWSILTM EI-2888 is the newest primerless silicone encapsulant from Dow Silicones. Featuring good primerless adhesion, inhibition resistance and superb optical clarity, this innovative product is particularly suitable for encapsulating rigid and flexible circuit boards for LED Lighting, explosion proof and high ingress protection rated luminaire.

PACE Arm-Evac 150

PACE launches Arm-Evac 150, a new low-cost fume extraction system for benchtop soldering and rework applications. The central filtration unit is a quiet, low profile, compact system which fits under any workbench. Comes complete with a general purpose combo filter, SteadyFlexTM ESD-safe arm & nozzle assembly and wireless remote control.

Surface Mount Materials

NXG33 Lead-free No-clean Solder Paste

Kester NXG33 is a lead-free, no-clean and halogen-free solder paste with state-of-the-art capabilities to support modern electronics assembly challenges. Kester NXG33 is fully capable of printing and reflowing 01005 components, even in air reflow, with minimal graping behavior. NXG33 can handle a wide variety of printer variables, including print speed, long idle times and a wide range of temperature and humidity. Post-soldering, the NXG33 offers minimized defects, including headin- pillow and QFN/BGA voiding. This paste meets the IPC definition for halogen-free and is classified as type ROL0 per IPC J-STD-004B. Kester NXG33 is available in Type 4 powder with the SAC305 alloy.


• Halogen-free per IPC definition

• Capable of 01005 print and reflow, even in air reflow environment

• Can print down to 8 mil x 8 mil apertures

• Designed specifically for fine feature printing with T4 powder

• Low QFN/BGA voiding

• Excellent solderability with halogen-free chemistry

• Optimized flux residues to mitigate head-inpillow defects

• Capable of print speeds up to 6 in/sec (150 mm/sec)

• Low slump behavior minimizes defects

• ICT probeable residues

• Reflowable in air or nitrogen

You can find any others Lead Free Solder Paste in the Kester website:

Easy Profile® 256 No-Clean Solderpaste

Easy Profile® 256 is a no-clean, air or nitrogen reflowable, solder paste specifically designed for maximum robustness in reflow profiling and stencil printing. EP256 has the widest possible reflow processing window. EP256 is also capable of stencil printing downtimes of up to 90 minutes with an effective first print down to 20 mils. EP256 is a solderpaste formula that maintains its activity and printing characteristics for up to 8 hours without any shear thinning.


• Stable wetting behavior over a wide range of profiles

• Capable of 90 minute break times in printing

• High print speeds to 200+ mm/sec (8+ in/sec)

• Compatible with enclosed print head systems

• Excellent printing characteristics to 0.4mm (16 mil) pitch with Type 3 powder

• High activity on all substrates, including OSPs

• Capable of off-pad printing with no solderballs after reflow

• Stencil life: 8+ hours (process dependent)

• Scrap is reduced due to less paste dry out

• Stable tack over 8+ hours

• Classified as ROL0 per J-STD-004

• Compliant to Bellcore GR-78

You can find any others Tin Lead Solder Paste in the Kester website:

Soldering Solder Tin Lead LeadFree
Glueing Coating Selective Conformal Paste
Thermally conductive Silicone Poliuretane Acryl Epoxy
Fluxing Flux Alcohol based Water based Bar
Wire UV BGA Rework X-ray