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Dow Silicones is launching EI-2888

DOWSILTM EI-2888 is the newest primerless silicone encapsulant from Dow Silicones. Featuring good primerless adhesion, inhibition resistance and superb optical clarity, this innovative product is particularly suitable for encapsulating rigid and flexible circuit boards for LED Lighting, explosion proof and high ingress protection rated luminaire.

PACE Arm-Evac 150

PACE launches Arm-Evac 150, a new low-cost fume extraction system for benchtop soldering and rework applications. The central filtration unit is a quiet, low profile, compact system which fits under any workbench. Comes complete with a general purpose combo filter, SteadyFlexTM ESD-safe arm & nozzle assembly and wireless remote control.

Wave Soldering Materials

979 VOC-Free No-Clean Liquid Flux

For Lead-bearing and Lead-free alloys

Kester 979 is a VOC-free, no-clean flux formulation for high quality, low-defect soldering of electronic circuit board assemblies. This flux's finely tuned activation system offers the best wetting available in VOC-Free liquid flux technology and the shiniest solder joints. Kester 979 also reduces micro solderballing on glossy laminates and between connector pins. Kester 979 will not attack properly cured solder masks or FR-4 Epoxy-Glass laminate. Kester 979 leaves a minimal amount of

residue after soldering. All remaining residues are non-corrosive, non-conductive and do not need to

be removed.


Performance Characteristics:

• Biodegradable at pH of 2.0 or greater

• Chemically compatible with most solder masks and board laminates

• Does not degrade Surface Insulation Resistance

• No offensive odors

• Bright, shiny solder connections

• Classified as ORL0 per J-STD-004

• Compliant to Bellcore GR-78

You can find any others Water Based Fluxes in the Kester website:

959T Low-Solids No-Clean Liquid Flux

Kester 959T is a no-clean, non-corrosive, liquid flux that is designed for the wave soldering of conventional and surface mount circuit board assemblies. Kester 959T was developed to minimize

the formation of micro-solderballs during wave soldering operations. This flux contains a small percentage of rosin (0.5%), which improves solderability, heat stability and surface insulation resistance. Kester 959T offers the best wetting and the shiniest solder joints of any no-clean, solvent-based chemistry. Kester 959T leaves evenly distributed residues for the best cosmetic appearance.


Performance Characteristics:

• Minimize micro-solderballs

• Extremely shiny joints

• No streaky, white residues

• Improves soldering performance

• Eliminates the need and expense of cleaning

• Classified as ORL0 per J-STD-004

• Compliant to Bellcore GR-78


You can find any others Alcohol Based Fluxes in the Kester website:

Ultrapure® High Reliability Extruded Bar Solder

Lead-bearing and Lead-free alloys

For soldering applications which require maximum reliability of solder joints, especially for surface mounted components, only solder of the highest purity is acceptable. Kester does not make any vague claims of outstanding solder purity. Complete analysis of Kester Ultrapure® Bar Solders prove that every batch conforms to the strictest quality control standards in the solder industry.

Ultrapure® SAC305

Extruded Low Dross Bar Solder


Lead-free wave soldering processes tend to produce a greater amount of dross than traditional leaded processes. For this reason, Kester produces all lead-free bar solder products with anti-drossing technology to improve process control and to allow the user to get the most value for the money with minimal maintenance costs. Kester Ultrapure® SAC305 Bar Solder was designed to minimize the amount of dross generated in a wave soldering, selective soldering or dip soldering process. Kester Ultrapure® SAC305 is manufactured with virgin metals which meet the high standards of Kester Ultrapure® line of bar solders. When molten solder comes in contact with air, it forms metal oxides or dross. This dross mixes in with the solder in the upper layer of solder in the solder pot to form a pasty solder dross mixture. Many solder impurities have been known to contribute to dross formation - aluminum, cadmium, iron and zinc are the most common of these. The purity level of Kester Ultrapure® SAC305 exceeds the industry requirements for allowable impurity levels, which helps control dross levels. Aside from exceptional control on solder purity, the Kester Ultrapure® SAC305 manufacturing process integrates a low dross additive to minimize dross formation during the soldering process. Additionally, Kester employs an extrusion manufacturing technique to minimize oxidation and alloy segregation during the manufacturing process. Old-fashioned methods of casting individual bars lacks protection from the atmosphere in the molten state and exposes more surface area which produces correspondingly more oxide.

Ultrapure® K100LD

Lead-free Bar Solder Alloy

Patent Pending


Pressure from marketing and legislation in both Europe and Asia have forced electronics manufacturers to move away from lead-based solders. Typical lead-free alloys contain 3-4% silver, which can be costly. In addition to cost concerns, typical Tin/Silver/Copper (or SAC) alloys also present issues with increased dissolution of Copper from boards and components during the soldering process. As an example, SAC305, one of the industry's most popular lead-free wave soldering alloys, is known to dissolve Copper at a rate more than twice as fast as Sn63Pb37. In response to demand for a low cost and low copper dissolution alloy, Kester has developed Ultrapure® K100LD. Kester K100LD is a eutectic Tin/Copper alloy with controlled metallic dopants to control the grain structure within the solder joint, and to minimize the dissolution of copper into the solder pot. K100LD virtually eliminates the occurrence of common defects such as icicling and bridging. The improved grain structure also results in shinier solder joints than traditional lead-free alloy alternatives.


You can find any others Bar Solders in the Kester website:

Soldering Solder Tin Lead LeadFree
Glueing Coating Selective Conformal Paste
Thermally conductive Silicone Poliuretane Acryl Epoxy
Fluxing Flux Alcohol based Water based Bar
Wire UV BGA Rework X-ray