Phone.: +36-1/299-70-70 | E-mail: sales@epselectronics.com
Dow Silicones is launching EI-2888
2019.02.18.

DOWSILTM EI-2888 is the newest primerless silicone encapsulant from Dow Silicones. Featuring good primerless adhesion, inhibition resistance and superb optical clarity, this innovative product is particularly suitable for encapsulating rigid and flexible circuit boards for LED Lighting, explosion proof and high ingress protection rated luminaire.

PACE Arm-Evac 150
2019.01.21.

PACE launches Arm-Evac 150, a new low-cost fume extraction system for benchtop soldering and rework applications. The central filtration unit is a quiet, low profile, compact system which fits under any workbench. Comes complete with a general purpose combo filter, SteadyFlexTM ESD-safe arm & nozzle assembly and wireless remote control.

Solder Paste Inspection

CyberOptics is the world's number-one supplier of solder paste inspection equipment used to monitor and control one of the most crucial steps affecting the finished quality of circuit boards. Solder paste deposition is the key process in board assembly operations using SMT techniques. Our LSM system was the industry's first popular method of manually inspecting solder paste; our SE systems revolutionized SMT production by offering an automated method for performing in-process inspection on the assembly line. With more than 3000 systems installed worldwide, CyberOptics has the largest installed base of solder paste inspection equipment in the industry.

See for yourself why CyberOptics is #1 in 3D solder paste inspection technology.

CyberOptics SE3000

A Leap Forward in Solder Paste Inspection

 

Maximize yields with the World’s First SPI system incorporating the MRS Sensor technology. When only the very best will do.

The new SE3000 3D SPI system is the world’s first SPI system to incorporate the industry-leading Multiple-Reflection Suppression (MRS) technology with a finer resolution for the best accuracy, repeatability and reproducibility – Even on the smallest paste deposits. Combined with the award-winning, easy-to-use SPI software, solder paste inspection has reached a new level of precision for the most stringent requirements.

SE3000-DD Dual Lane, Dual Sensor system and SE3000-X also available.

 

Link to manufacturer

CyberOptics SE500 Ultra

World-Class Accuracy At Fastest Speed

 

The SE500ULTRA™ system is power-packed with 30% more speed, newly designed V5 series software enabling world class user experience and optional dual illumination sensor.

An all-new, improved ultrafast sensor combined with a unique ‘all-in-one’ scan technique – that integrates fiducial, barcode and range scans into one, seamless scan sequence – makes the SE500ULTRA 30% faster at 210cm²/sec.

You can choose the Dual Illumination sensor option for best repeatability and reproducibility results – even on the smallest paste deposits.

 

Key Features and Benefits

  • All-new, Ultrafast sensor with calibration-free design
  • 30% faster with unique ‘all-in-one’ scan sequence
  • New, Intuitive Touch Screen Interface with World-class Usability
  • Improved Repeatability with Dual Illumination Sensor Option
  • Closed Loop Printer Feedback Ready
  • CyberPrint OPTIMIZER™ Ready
  • Mounter Feed Forward Ready

 

Link to manufacturer

CyberOptics SE500 Ultra

Soldering Solder Tin Lead LeadFree
Glueing Coating Selective Conformal Paste
Thermally conductive Silicone Poliuretane Acryl Epoxy
Fluxing Flux Alcohol based Water based Bar
Wire UV BGA Rework X-ray

 

Honlapkészítés: Ujlap.hu